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基于QFN封装IC的印制板设计和装配

基于QFN封装IC的印制板设计和装配

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

基于QFN封装IC的印制板设计和装配

Order On-line at http://www.emrimaruf.com/doc/info-dcf4330dbb68a98271fefa15.html v00.0902Introduction The need for low-cost surface mount plastic packages that operate to high frequency with low package thermal resistance has led to the development of Quad Flatpack No-Lead (QFN) packages. The industry standard description for these packages is JEDEC MO-220 or “Thermally enhanced plastic very thin and very fi ne pitch quad fl at no lead package (QFN)”. Hittite Microwave Corporation offers standard products in QFN packages operating at frequencies up to 16 GHz. To successfully integrate these new packages into a system design, proper PCB layout, handling and assembly guidelines must be followed.General Description of QFN (LPCC) Packages Hittite standard products that make use of QFN packages carry the simple suffi x “LP3” or “LP4”, representing leadless packages that are 3x3mm (fi gure 1a) or 4x4mm (fi gure 1b) in size. These packages typically contain 16 and 24 I/Os respectively and have exposed metal on the underside of the package that must be attached to both an RF ground

基于QFN封装IC的印制板设计和装配

基于QFN封装IC的印制板设计和装配

plane and a proper thermal path. LP3 & LP4 NOTES:1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED.2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY 3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS].5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.

基于QFN封装IC的印制板设计和装配

Figure 1a – LP3 outline Figure 1b– LP4 outline PCB DESIGN AND ASSEMBLY FOR QFN PACKAGES

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